发明名称 |
SYSTEM UND VERFAHREN ZUR THERMISCHEN BEHANDLUNG EINER KOMBINATION VON EINEM OBEREN UND EINEM UNTEREN SUBSTRAT VOR EINER AUSHÄRTUNGSBEHANDLUNG |
摘要 |
A system and method cures a combination of a top and a bottom substrate with a resin disposed in-between. A cure device inherently warps the combination in one direction as a result of a curing operation that the cure device performs on the combination. A temperature gradient inducing device is disposed closer to one of the top and bottom substrates to create a temperature gradient between the top and bottom substrate and thereby warp the combination in a direction opposite to the one direction. |
申请公布号 |
DE69803942(T2) |
申请公布日期 |
2002.11.07 |
申请号 |
DE1998603942T |
申请日期 |
1998.11.12 |
申请人 |
STEAG HAMATECH, INC. |
发明人 |
PAULUS, W.;LIGHT, H.;PARENT, R.;PARENT, G.;RAMANATHAM, ELANGOVAN |
分类号 |
B29C65/00;B29C65/78;G11B7/26 |
主分类号 |
B29C65/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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