ASSEMBLIES COMPRISING MOLYBDENUM AND ALUMINUM; AND METHODS OF UTILIZING INTERLAYERS IN FORMING TARGET/BACKING PLATE ASSEMBLIES
摘要
The invention includes an assembly (130) having a physical vapor deposition target (102) separated from a backing plate (120) with a layer (104) consisting essentially of one or both of molybdenum and tantalum. The invention also includes an assembly comprising a backing plate of at least 99.9 % aluminum bound to a target of at least 99.9 % molybdenum through a bond having a strength of at least about 6,000 pounds per square inch (psi). Additionally, the invention includes a method of bonding a tungsten-containing material to an aluminum-containing material. A layer of molybdenum-containing material (104) is provided between the tungsten-containing material (102) and the aluminum-containing material (120); and is bonded to both the tungsten-containing material (102) and the aluminum-containing material (120).
申请公布号
WO02088417(A1)
申请公布日期
2002.11.07
申请号
WO2002US09640
申请日期
2002.03.29
申请人
HONEYWELL INTERNATIONAL INC.;MISNER, JOSH, W.;MORALES, DIANA;KELLER, JEFF, A.