发明名称 |
Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer deposition |
摘要 |
A new method and apparatus for avoiding contamination of films deposited in layered depositions, such as Atomic Layer Deposition (ALD) and other sequential chemical vapor deposition (CVD) processes, is taught, wherein CVD-deposited contamination of ALD films is prevented by use of a pre-reaction chamber that effectively causes otherwise-contaminating gaseous constituents to deposit on wall elements of gas-delivery apparatus prior to entering the ALD chamber.
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申请公布号 |
US2002162506(A1) |
申请公布日期 |
2002.11.07 |
申请号 |
US20020186071 |
申请日期 |
2002.06.28 |
申请人 |
SNEH OFER;GALEWSKI CARL J. |
发明人 |
SNEH OFER;GALEWSKI CARL J. |
分类号 |
C23C8/00;C23C16/44;C23C16/452;C23C16/455;H01L21/285;H01L21/314;H01L21/316;(IPC1-7):C23C16/00 |
主分类号 |
C23C8/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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