Dielectronic composition for manufacturing insulating structures

摘要

The present invention is related with a dielectric composition for the manufacture of an insulating structure of the type that comprises at least a dielectric resin. The composition comprises granules of a thermoset polymer and a dielectric resin in a ratio thermoset polymer/dielectric resin in the scale of 2:1 to 20:1, which allows it to support voltages of at least 45 kV and to have resistances of at least 25 MOMEGA. The invention further comprises dielectric structures obtained from the composition, which can be increased in their dielectric strength by means of a layer of dielectric resin.