| 摘要 |
<p>A high-frequency module with a distributed constant circuit comprises a base substrate (2) and a high-frequency element layer section (5). The base substrate has a high-frequency element layer face (3) formed by flattening the topmost layer of a multilayered printed wiring section of a printed wiring layer having a ground section on one main face of a core substrate (6) and a dielectric insulation layer consisting of a dielectric insulation material. The high-frequency element layer section has a passive element and a circuit element which are supplied with a power source or a signal from the base substrate (2) via the dielectric insulation section consisting of a dielectric insulation material. The base substrate (2) has a distributed constant circuit (4) formed from a pattern wiring.</p> |
