Compact sensing apparatus having an angled sensor formed in a dual-piece monolithic substrate

摘要

A sensing apparatus having a sensor formed in a monolithic semiconductor substrate and oriented orthogonally to a signal conditioner is provided. The sensor generates a sensing signal in response to a predetermined physical stimulus. A signal conditioner electrically connected and responsive to the sensor conditions the sensing signal. The sensor and signal conditioner are formed on wafer surfaces of a single semiconductor substrate cut from a semiconductor wafer. The substrate is separated, one portion having the sensor formed on therein and the other having formed therein the signal conditioner. The portions are oriented and rejoined to form a monolithic semiconductor substrate. The resulting monolithic substrate has, then, a sensor and signal conditioner formed therein and angled relative to each other at a predetermined angle.