| 摘要 |
The invention relates to, in particular, a semiconductor component, particularly a micromechanical pressure sensor (200), comprising a membrane electrode (206), a cavity (208), which is located underneath the membrane, and a bottom electrode (202, 203), which is also located underneath the membrane. In order to improve the reliability of the semiconductor component, the invention provides, in particular, a bottom electrode that is comprised of a first and a second electrode (202, 203), whereby the second electrode (203) surrounds the first electrode (202) to a large extent.
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