DIELECTRIC HEATING OF THERMOPLASTIC COMPOSITIONS

摘要

A HF responsive composition is described comprising (A) a molecular sieve material, and (B) at least one interpolymer comprising (i) polymer units derived from at least one aliphatic olefin monomer having from 2 to 20 carbon atoms; and (ii) polymer units derived from (a) at least one vinyl or vinylidene aromatic monomer, or (b) from at least one sterically hindered aliphatic or cycloaliphatic vinyl or vinylidene monomer, or (c) from a combination of at least one vinyl or vinylidene aromatic monomer and at least one sterically hindered aliphatic or cycloaliphatic vinyl or vinylidene monomer, and optionally (d) polymer units derived from at least one ethylenically unsatured polymerizable monomer other than that derived from (a), (b) or (c). The HF responsive composition of the invention can be heated in a dielectric heating process and is useful, for example, to make articles of manufacture which are formed or assembled using HF welding technology.