Heat conductive silicone composition and semiconductor device

摘要

A heat conductive silicone composition comprising (A) an alkenyl group-bearing organopolysiloxane, (B) an organohydrogenpolysiloxane having Si-H groups on side chains, (C) an organohydrogenpolysiloxane having an Si-H group at either end, (D) a filler consisting of aluminum powder and zinc oxide powder in a weight ratio of from 1/1 to 10/1, (E) a platinum catalyst, and (F) a regulator has a high thermal conductivity and maintains flexibility even when exposed to heat for an extended period of time.