发明名称 APPARATUS FOR COOLING PLASMA POLYMERIZATION EQUIPMENT
摘要 PURPOSE: An apparatus for cooling plasma polymerization equipment is provided to improve thickness uniformity of a polymer film deposited on a material to be processed by uniformly cooling internal temperature of a process chamber so that stable plasma is formed in the process chamber. CONSTITUTION: The apparatus for cooling plasma polymerization equipment comprises a process chamber(11) for depositing a polymer film on a material to be processed(12); an electrode(15) that is fixed to the inner part of the process chamber; and a cooling box(20) that is installed at the surroundings of the electrode(15) to uniformly cool the inner part of the process chamber(11), wherein the cooling box(20) comprises a channel in which a coolant is flown; a coolant supply pipe(24) that is installed at one side of the cooling box to supply the coolant; a coolant discharge pipe(25) that is installed at the other side of the cooling box to discharge the coolant; and a coolant supply part that is connected to the coolant supply pipe and coolant discharge pipe through the channel, and wherein each cooling chambers(23) are formed by installing a cross shaped partition(22) inside the hollow part of a box main body(21) of the cooling box, a coolant supply pipe(24) for supplying the coolant to each of the cooling chambers is installed on the outer wall of the cooling chambers, and each coolant discharge pipes(25) are installed on the upper surface of the cooling chambers(23) for uniformly cooling the plasma polymerization equipment.
申请公布号 KR20020083606(A) 申请公布日期 2002.11.04
申请号 KR20010023022 申请日期 2001.04.27
申请人 LG ELECTRONICS INC. 发明人 MUN, JEONG UK
分类号 C23C16/44;(IPC1-7):C23C16/44 主分类号 C23C16/44
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