| 摘要 |
PURPOSE: A tape for processing a semiconductor wafer is provided to prevent a wrapage of a wafer by attaching a stiffener to a protection tape film. CONSTITUTION: An UV(Ultra Violet) adhesive(110) is coated on a wafer(100) having desired patterns. In order to prevent a wrapage of the wafer(100) due to friction heat during a CMP(Chemical Mechanical Polishing), a stiffener(120) having a desired elastic force and a desired strength is formed on the UV adhesive(110). Preferably, a plastic plate, an acryl plate or a glass substrate is used as the stiffener(120). Also, a protection tape film(130) is formed between the wafer(100) and the UV adhesive(110).
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