| 摘要 |
PURPOSE: A wafer transfer apparatus for semiconductor fabrication is provided to transfer stably a wafer by forming a front and rear driving portion, a left and right driving portion, and an up-and-down driving portion. CONSTITUTION: A multi-shaft driving portion is formed with a front and rear driving portion(110), a left and right driving portion(120), and an up-and-down driving portion(100). The front and rear driving portion(110) is formed with a bottom plate(113), a front and rear driving body(111), and an LM guide(112), and the bottom. A plurality of blades(130) are installed in front of the front and rear driving body(111). A wafer(140) is loaded on an upper portion of the blades(130). The left and right driving portion(120) is formed with a left and right driving body(121), a left and right driving ball screw(122), and a left and right driving motor(123). The up-and-down driving portion(100) is formed with an up-and-down driving body(101), an up-and-down driving ball screw(102), and an up-and-down driving motor(103).
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