TEST SOCKET FOR PIN-INSERTION TYPE SEMICONDUCTOR CHIP PACKAGE

摘要

PURPOSE: A test socket for a pin-insertion type semiconductor chip package is provided to reduce the generation of bent lead by inserting an outer lead shoulder part contacting connection pins facing a test socket, and minimize the connection length between the test socket and the connection pins. CONSTITUTION: A test socket for a pin-insertion type semiconductor chip package includes a socket body(20) formed with a receiving grooves on a top surface by a uniform depth larger than a width of a pin-insertion type semiconductor chip package and connection pin mounting block insertion grooves(23) on a lower surface to be connected to the receiving groove, and the connection pin mounting blocks(30) to be inserted into the connection pins mounting block insertion grooves and formed with a plurality of connection pins(31) on outer peripheral surfaces by a pitch equal to the lead pitch of the semiconductor chip package, the connection pins being exposed via the receiving grooves and elastically moving.