发明名称 THERMAL FLOW SENSOR
摘要 PURPOSE: To provide a highly-reliable thermal flow sensor. CONSTITUTION: The thermal flow sensor is provided with a tabular substrate 1 having a first and a second through-holes 10b, 10a formed in a line, an insulated supporting film tacked across one side face of the substrate 1 so as to fill in the first and the second through-holes 10b, 10a, a fluid temperature thermal resistance 5 formed by a thermal resistance film at the first through-hole 10b location of the supporting film 2 on the opposite face of the substrate, an exothermic resistance 4 formed by the thermal resistance film at the second through-hole location 10a of the supporting film 2 on the opposite face of the substrate, and an insulated protective film 3 furnished so as to cover both the fluid temperature thermal resistance 5 and the exothermic resistance 4. In the thermal flow sensor measuring flow rate or flow velocity of a fluid based on heat transfer phenomenon from the heated exothermic resistance 4 to the fluid, the fluid temperature thermal resistance 5 is provided with a reinforced film 6 while the exothermic resistance 4 is not.
申请公布号 KR20020083420(A) 申请公布日期 2002.11.02
申请号 KR20020005763 申请日期 2002.01.31
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 KAWAI MASAHIRO;TAGUCHI MOTOHISA
分类号 G01F1/692;G01F1/684;(IPC1-7):G01F1/692 主分类号 G01F1/692
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