POLISHING PAD FOR SEMICONDUCTOR WAFER AND LAMINATED BODY FOR POLISHING OF SEMICONDUCTOR WAFER EQUIPPED WITH THE SAME AS WELL AS METHOD FOR POLISHING OF SEMICONDUCTOR WAFER

摘要

PURPOSE: A polishing pad for a semiconductor wafer is provided to optically monitor every polishing state at all times during a polishing process as well as a polishing endpoint by easily performing an optical endpoint detection process without lowering the polishing performance. CONSTITUTION: The polishing pad(1) includes a water-insoluble matrix material such as crosslinked 1,2-polybutadiene and a water-soluble particle such as beta-cyclodextrin dispersed in this water-insoluble matrix material. The polishing pad has light transmitting properties so that polishing endpoint can be detected with a light.