发明名称 DEVICE FOR CUTTING LEAD OF ELECTRONIC PART AND METHOD OF DETECTING WEAR OF CUTTING EDGE
摘要 PROBLEM TO BE SOLVED: To detect a faulty part caused by the wear of a cutting edge when cutting the lead of an electronic part. SOLUTION: Upper edges 2a and 2b and lower edges 4a and 4b are provided in opposition. The upper edges 2a and 2b are connected to a drive source not shown in the figure. A supporting stage 3 is provided in opposition to electrodes 1a and 1b, inside the upper edges 2a and 2b and the lower edges 4a and 4b. An electronic part 5 fitted with a lead is set on the supporting stage 3, and the upper edges 2a and 2b cut the lead of the electronic part 65 by pressing. At this time, the electrodes 1a and 1b goes down to catch the lead of the electronic part 6 with the supporting stage 3 at the same time with the processing of the upper edges 2a and 2b. After cutting, only the upper edges 2a and 2b goes up, and then the electrodes 1a and 1b measure the resistance value of the electronic part 6. In the case that the the cutting edges is worn away, it is detected as the inferiority of the product.
申请公布号 JP2002319798(A) 申请公布日期 2002.10.31
申请号 JP20010124183 申请日期 2001.04.23
申请人 NEC CORP 发明人 NAWANO HIDEKI
分类号 H01G13/00;H05K13/04;H05K13/08 主分类号 H01G13/00
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