| 摘要 |
PROBLEM TO BE SOLVED: To provide a base for printed-wiring boards where size and weight can be reduced, dielectric characteristics, heat resistance, hygroscopic heat resistance, and stability in dimensions are excellent, and change in the dimensions is small in a thickness direction where the metal plating section of a via hole and a conductive resin cannot be easily cut from metal wiring, and to provide a prepreg and a printed-wiring board using the prepreg. SOLUTION: The base for printed-wiring boards is a nonwoven fabric cloth which should be made of fiber where a melt point or decomposition temperature is set to 270 deg.C or higher, and should have a thermal coefficient of expansion of +50×10<-6> / deg.C to -50×10<-6> / deg.C in a surface direction and that of +500×10<-6> / deg.C to -500×10<-6> / deg.C in a sectional direction at 200 to 300 deg.C. In addition, in the prepreg, resin varnish should be impregnated into the base for printed-wiring boards. The printed-wiring board should be manufactured by the prepreg. |
