| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-performance base for printed-wiring boards where costs are low, size and weight can be reduced, dielectric characteristics, heat resistance, hygroscopic heat resistance, and stability in dimensions are excellent, and change in the dimensions is small in a thickness direction where the metal plating section of a via hole and a conductive resin cannot be easily cut from metal wiring, and to provide a prepreg and a printed-wiring board using the prepreg. SOLUTION: The base for printed-wiring boards is a nonwoven fabric cloth which should be made of fiber where a melt point or decomposition temperature is set to 270 deg.C or higher, should contain polyphenylene sulfide fiber, and should have a thermal coefficient of expansion of +100×10<-6> / deg.C to -100×10<-6> / deg.C in a surface direction and that of +500×10<-6> / deg.C to -500×10<-6> / deg.C in a sectional direction at 200 to 300 deg.C. In addition, in the prepreg, resin varnish should be impregnated and contained into the base for printed-wiring boards. The printed- wiring board should be manufactured by the prepreg. |
