Formation of an optical component

摘要

A method of forming an optical component is disclosed. The method includes obtaining a wafer having a light transmitting medium positioned over a base. The method also includes applying an etching medium to the wafer so as to form one or more surfaces of an optical component in the light transmitting medium. The etching medium is applied in an etching chamber configured to etch a wafer having at least one dimension with a length greater than 6 inches.