发明名称 |
Cooling arrangement for high density packaging of electronic components |
摘要 |
A cooling arrangement facilitates the cooling of a plurality of integrated circuit elements disposed on a plurality of substrates that are substantially perpendicularly mounted on a main substrate. In an example embodiment, the cooling arrangement provides cooling for a plurality of integrated circuit elements disposed on a plurality of substrates that are substantially perpendicularly mounted on a main substrate. The cooling arrangement includes a plurality of U-shaped thermally conductive members, each having a set of leg portions connected with a top portion and an open end disposed over a respective one of the substrates. In addition, a first inner surface of at least one of the leg portions is in thermal contact with at least one of the integrated circuit elements. The cooling arrangement further includes a housing member containing therein the U-shaped members and includes a cooling plate arrangement in thermal contact with the housing and the top portions of the U-shaped members. |
申请公布号 |
US2002159237(A1) |
申请公布日期 |
2002.10.31 |
申请号 |
US20010845546 |
申请日期 |
2001.04.30 |
申请人 |
PATEL CHANDRKANT D.;BARBER VERNON ALAN;OBERMAIER HANNSJORG;BELADY CHRISTIAN;CHASTAIN DAVID MIKE |
发明人 |
PATEL CHANDRKANT D.;BARBER VERNON ALAN;OBERMAIER HANNSJORG;BELADY CHRISTIAN;CHASTAIN DAVID MIKE |
分类号 |
H01L23/367;H01L23/427;H01L23/433;H01L25/065;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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