Electronic component with semiconductor chip has conductive wiring clips which engage side of chip and make contact with connection pads

摘要

The device has at least one semiconductor chip (2) having an active front side (4) with semiconductor structures, and a passive back side (3) without semiconductor structures. Contact connections (8) or pads (10) are provided on the front or back side. Wiring arrangements in the form of conductive clips (6) are provided for making electrical connections from the active front side to the passive back side. The clips engage with at least one side of the semiconductor chip, and may be made of metal, plastics, or plastics-coated flexible metal. Independent claims are also included for an electronic module, and for a method of manufacturing an electronic module.