| 摘要 |
PURPOSE: A semiconductor device having a fuse and a method of disconnecting the fuse are provided to be capable of reducing damages on an insulating film under a fuse upon disconnecting the fuse by a laser. CONSTITUTION: The first insulating film(12) made of silicon oxide is formed on a semiconductor substrate(11). A lower wire including lines(13a,13b) is formed on the first insulating film(12). At this time, the lower wire is made of aluminum, an aluminum alloy, or other metallic materials. At the time, the first insulating film(12) is made of PSG(Phospho-Silicate Glass), FSG(Fluoro-Silicate Glass) or other materials. The second insulating film(14) made of silicon oxide is formed on both of the first insulating film(12) and the lower wire. A fuse(15) is formed on the second insulating film(14). A high-strength protective member(14c) made of tungsten is disposed under a disconnecting point of a fuse(15). This protective member(14c) is formed simultaneously with formation of a via contact portion(14a,14b) which connects the fuse(15) with the lines(13a,13b) of the lower wire. |
