| 摘要 |
PROBLEM TO BE SOLVED: To precisely and economically make a semiconductor chip thin by polishing its reverse surface. SOLUTION: A chip tray 10 is manufactured by forming many storage grooves 12 each having a vacuum suction hole 13 and an escape groove 14 in a tray substrate 11 formed of a semiconductor wafer together by photolithography at a time with high precision; and semiconductor chips 20 having been diced are put in the respective storage grooves 12 of the chip tray 10, which is mounted on a wafer holding jig 32 of a wafer grinding device 30 instead of the wafer, so that the reverse surfaces of the semiconductor chips 20 are ground together. The escape grooves 14 eliminate variance in grinding pressure due to projections of bump electrodes 21 of the semiconductor chips 20 and thickness control by the reverse-surface grinding under uniform, and high- precision machining size control can be exercised over the semiconductor chips 20 stored in the chip tray 10.
|
