| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, and its manufacturing method, in which enhancement of grounding can be realized inexpensively. SOLUTION: The semiconductor device comprises a resin tape 23 having a device hole 22 for connecting a semiconductor chip, a conductive layer 24 arranged on one side of resin tape while partially projecting into the device hole to form a plurality of inner leads 24a and provided with a plurality of electrode pads 24b, a semiconductor chip connected with the inner leads, and solder balls 25 formed on the electrode pads. Since the ground line of the inner lead is connected through a conductive material 26, grounding is enhanced and electric characteristics can be improved.
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