| 摘要 |
PROBLEM TO BE SOLVED: To raise heat insulation characteristics at an oven opening part of a semiconductor manufacturing device, to reduce radiated heat amount, resulting in less thermal load on each heat-insulation part. SOLUTION: The semiconductor manufacturing device comprises a heat treatment oven which at least comprises a pipe 4 and a heater unit 2 so concentrically provided as to enclose the pipe. A heat-insulating ring packing 38 is provided at a lower end of a space 25 formed with the pipe and the heater unit. The heat-insulating ring packing comprises a peripheral part 40 interposed in a gap 20 communicating with the space, and a heat-insulating ring body 39 which, formed integrally with the peripheral part, closes the space which is gap faces.
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