| 摘要 |
A low-cost and easy-to-manufacture IC chip module which carries both contact-system and non-contact-system functions by packaging on a card with a terminal section containing an IC chip, a coil, and an antenna section integrated into a module, and an IC card. This module is a package built in a generally used IC card (1) with an IC chip (4) containing at least a memory and having an interface section for transmitting and receiving signals in response to a CPU or an external apparatus, a contact mechanism (2) for electric response to a first external device, and a coupling mechanism (3) for non-contact response to the first external device or a second external device integrated into a module. |
