| 摘要 |
<p>An electronic device package is attached to a printed wiring board with an interposer formed from a sheet of material to contain a lower surface and an elevated upper surface that surrounds the lower surface and a plurality legs along the edge of the upper surface. The electronic device package is attached to the upper surface. The lower surface is attached to the printed wiring board. The legs are attached to the printed wiring board. The transition between the lower surface and the upper surface are in staircase pattern, as are the legs. Vent slots are included in the transition between the lower and upper surfaces.</p> |
