发明名称 BORON-CONTAINING POLYMER COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a new boron-containing polymer composition having excellent water resistance, moisture resistance, heat resistance, mechanical strength, or the like, applicable to a semiconductor element, an electric circuit part, or the like, having excellent film-forming properties. SOLUTION: This boron-containing polymer composition is characterized by comprising a polymer obtained from a borazine compound and a compound represented by the formula (1) R<1> m Si(OR<2> )n (R<1> is hydrogen atom, an alkyl group, vinyl group or a functional group-containing alkyl group; R<2> may be the same or different and is hydrogen atom, an alkyl group or an acyl group; (n) is an integer of >=3; (m) is an integer of >=0; m+n=4) and/or its hydrolytic condensate.
申请公布号 JP2002317049(A) 申请公布日期 2002.10.31
申请号 JP20010119620 申请日期 2001.04.18
申请人 NIPPON SHOKUBAI CO LTD 发明人 YAMAMOTO TETSUYA;KAMIYAMA TAKUYA
分类号 C08G79/08;(IPC1-7):C08G79/08 主分类号 C08G79/08
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