| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor-sealing which has excellent characteristics in flame retardance and solder-cracking resistance. SOLUTION: The epoxy resin composition for semiconductor-sealing comprises as essential components (A) a phenolaralkyl-type epoxy resin containing a diphenylene skeleton, (B) a biphenyl-type epoxy resin, (C) a phenolaralkyl resin containing a diphenylene skeleton, (D a curing promotor, and (E) an inorganic filler, the weight ratio (A) to (B) [(A)/(B)] being 1-10.
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