发明名称 |
Curable organopolysiloxane composition and method of manufacturing semiconductor devices with the use of the aforementioned composition |
摘要 |
A curable organopolysiloxane composition comprises: (A) an organopolysiloxane with two or more silicon-bonded hydrogen atoms contained in one molecule in an amount not exceeding 0.05 wt. %; (B) an organopolysiloxane with two or more alkenyl groups in one molecule {alkenyl groups of this components are to be in an amount of 0.01 to 1 mole per 1 mole of a silicon-bonded hydrogen atoms contained in said component (A)}; and (C) a hydrosilylation-reaction metal catalyst (with content of metal atoms within the range of 0.01 to 1,000 ppm in terms of weight units). A method of manufacturing a semiconductor device comprises: applying onto the surface of a semiconductor device and curing, the aforementioned curable organopolysiloxane composition. |
申请公布号 |
US2002160624(A1) |
申请公布日期 |
2002.10.31 |
申请号 |
US20020094231 |
申请日期 |
2002.03.07 |
申请人 |
YAMAKAWA KIMIO;NAKAYOSHI KAZUMI;ISHIKAWA HIROKI;SHIMA RYOTO;NAKANISHI JUNJI;KATO TOMOKO;ISSHIKI MINORU;MINE KATSUTOSHI |
发明人 |
YAMAKAWA KIMIO;NAKAYOSHI KAZUMI;ISHIKAWA HIROKI;SHIMA RYOTO;NAKANISHI JUNJI;KATO TOMOKO;ISSHIKI MINORU;MINE KATSUTOSHI |
分类号 |
C08L83/05;C08F283/12;C08L83/07;H01L21/312;H01L23/29;H01L23/31;(IPC1-7):H01L21/31;H01L21/469 |
主分类号 |
C08L83/05 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|