发明名称 PREPARATION METHOD OF HEAT RESISTANT THERMOPLASTIC RESIN COMPOSITION
摘要 PURPOSE: A method for preparing a heat resistant thermoplastic resin composition is provided, to improve the heat resistance, the impact resistance, the processability and the latex stability. CONSTITUTION: The method comprises the steps of inserting 1-30 wt% of a monomer mixture of 40-65 parts by weight of an aromatic vinyl compound, 10-25 parts by weight of a cyano vinyl compound and 15-40 parts by weight of a maleimide compound to a reactor and emulsion polymerizing the monomer mixture; inserting 70-99 wt% of the monomer mixture (the remaining monomer mixture) and 1-20 parts by weight of an ethylene-based unsaturated amide to the reactor continuously for 2-5 hours and emulsion polymerizing the monomers with the polymer. Preferably the aromatic vinyl compound is selected from the group consisting of styrene, α-methylstyrene, o-ethylstyrene, p-ethylstyrene and vinyl toluene; the cyano vinyl compound is selected from the group consisting of acrylonitrile, methacrylonitrile and ethacrylonitrile; the maleimide compound is selected from the group consisting of N-phenylmaleimide, N-ethylmaleimide and N-cyclohexylmaleimide; and the ethylene-based unsaturated amide compound is methacrylamide or acrylamide.
申请公布号 KR100360947(B1) 申请公布日期 2002.10.31
申请号 KR19940036788 申请日期 1994.12.26
申请人 LG CHEM. LTD. 发明人 PARK, BONG HYEON;YOO, GEUN HUN
分类号 C08F279/00;(IPC1-7):C08F279/00 主分类号 C08F279/00
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