| 摘要 |
<p>A method and apparatus for treating a workpiece using capillary discharge plasma are disclosed in the present invention. The method of desmearing holes in a copper laminated board (214) and forming a conductive material in the holes using an atmospheric pressure capillary discharge plasma apparatus includes the steps of drilling the copper laminated board (214) to remove at least a portion of the copper laminated board, placing the copper laminated board (214) having the holes in the apparatus, applying a potential to the plasma generator, providing a working gas in close proximity to the copper laminated board (214), generating capillary discharge plasma out of the capillary (213), thereby treating the copper laminated board (214) with the atmospheric pressure capillary discharge plasma to remove resin residues in the holes, and forming the conductive material on the copper laminated board including in the holes.</p> |
