发明名称 LAYING STRUCTURE OF PLAIN TILE
摘要 PROBLEM TO BE SOLVED: To provide a laying structure of a new plain tile, which prevents a failure to attach a waterproof coupling material, and which reliably realizes a high rate of exposure of the plain tile and an original waterproof effect brought about by using the waterproof coupling material. SOLUTION: In the laying structure of the plain tile (1), the waterproof coupling material (2) is provided on a backside of a butt joint part between side ends of the right and left plain tiles (1) adjacent to each other so as to lay and overlap the plain tiles (1). A notched part (11) is provided at the side end of the plain tile (1), and the coupling material (2) can be visually recognized from the notched part (11).
申请公布号 JP2002317528(A) 申请公布日期 2002.10.31
申请号 JP20010121018 申请日期 2001.04.19
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 KAWAGUCHI TAKESHI
分类号 E04D1/12;(IPC1-7):E04D1/12 主分类号 E04D1/12
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