SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

A non-lead type semiconductor device with a large terminal strength and a high reliability which has a sealant made of an insulation resin, a tab-hanging lead and leads exposed to the mount face of the sealant, a semiconductor element located within the sealant and fixed on a tab surface with a bond, and conductive wires electrically connecting the electrodes of the semiconductor element with the leads. At least a part of the lead is a reverse-trapezoidal crosssection constituted by a bottom face facing the top face and exposed from the sealant and by side faces combining both side edges of the top face and the bottom face. Both side edges of the top face are provided with a worked face one end of which is connected to the top face, and the other end of which is connected to the side face, and the top face and the side face of which are formed by crushing work different in extension direction. The angle between the top face and the worked face is larger than 90 DEG C.