| 摘要 |
PROBLEM TO BE SOLVED: To realize reduction of semiconductor chip size and the effective use of a scribe region, since many monitor patterns are made in the scribe region so as to manufacture a semiconductor device. SOLUTION: The effective use of the scribe region 10 and the scale down of the chip size are enabled by forming electrode patterns 1, 2, 3, and 4 for measuring an element characteristics check pattern for a combined use as marks for dicing of the crossing of scribe regions 10, on a wafer. |
