| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic-part mounting module with superior heat dissipating characteristics and reliability without forced load on a junctional part between a board and an electronic part. SOLUTION: A flexible printed board 11 includes a main board 14 for mounting an IC bar chip 14 and a projected part 15 projected from the main board 14 and having a heat radiating pattern made of superior heat dissipating material. The projected part 15 is folded around the main board 14, and the heat dissipating pattern 13 is put in contact with the IC bar chip 20 to from a heat dissipating part.
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