| 摘要 |
PROBLEM TO BE SOLVED: To shorten the time required for the process of providing a semiconductor element with an insulation adhesive material. SOLUTION: A mask 18, provided with a plurality of holes 17, is mounted on the surface of a semiconductor wafer 15, so as to respectively position the holes 17 in adhesive material forming regions on the surfaces of the respective semiconductor elements formed on the semiconductor wafer 15, the insulation adhesive material 7 is supplied via the mask 18 to the surface of the semiconductor wafer 15, the mask 18 is separated from the semiconductor wafer 15 and by leaving only the insulation adhesive material 7A inside the holes 17 is left in the adhesive material forming regions, the insulation adhesive material 7A is provided in the adhesive material forming region of the respective semiconductor elements, in batch and at the same time prior to dicing by semiconductor units. |
