发明名称 LIGHT EMITTING ELEMENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To manufacture a light emitting element 5 which is used for making optical communication possible between integrated circuit elements 2 and 40 with a high-accuracy outside diameter D1 at an accurate position. SOLUTION: An SiO2 coating layer 3 is formed on an integrated circuit element 2 composed of a silicon semiconductor substrate and an electron beam 4 is projected upon a desired region to be irradiated of the layer 3 in a high- vacuum atmosphere. When the layer 3 is irradiated with the beam 4, the oxygen of the SiO2 is liberated and Si atoms appear. When the beam 4 is continuously projected upon the region, a light emitting layer 5 composed only of Si atoms reaches the integrated circuit element 2 composed of the silicon semiconductor substrate and finally formed through an SiO2 electrical insulating layer 6. A translucent electrode 7 is formed on the light emitting layer 5 and its circumference and a voltage is applied across both end sections of the layer 5 in the thickness direction. The light from the layer 5 is guided to the light receiving element 35 of another integrated circuit element 40 through a light guiding member 29 and makes optical communication possible. The outside diameter D1 of the light emitting layer 5 is adjusted to, for example, 1-20 nmϕ.
申请公布号 JP2002319701(A) 申请公布日期 2002.10.31
申请号 JP20010123093 申请日期 2001.04.20
申请人 KANSAI TLO KK 发明人 SHIMIZU RYUICHI;TAKAI YOSHIZO;KIMURA YOSHIHIDE
分类号 H01L33/34;H01L33/58 主分类号 H01L33/34
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