| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor polishing device which makes it possible to uniformly polish the entire reverse surface of a wiring layer of a chip wile observing without interrupting the polishing of the chip to observe its polished surface. SOLUTION: The reverse surface of the wiring layer 22a of the chip 22 is scanned with infrared light and polished while a wiring pattern 22b is observed. Consequently, a defect of the wiring pattern 22b can be found and the wiring pattern is eliminated, so that the end point of polishing can be confirmed. |
