发明名称 |
Solderability testing apparatus and solderability testing method |
摘要 |
This invention discloses a solderability testing apparatus which comprises a sample parts holding means having a sample parts holding member for holding a sample; an external force detection means for supporting such sample parts holding means; a solder paste container for containing a solder paste which is internally added with a flux; and a heating means for heating the solder paste; wherein such apparatus has a flux wetting preventive layer at least on the surface of a sample holding portion of the sample parts holding member.
|
申请公布号 |
US2002157486(A1) |
申请公布日期 |
2002.10.31 |
申请号 |
US20020080132 |
申请日期 |
2002.02.21 |
申请人 |
MASATOKI TAMIHARU;SHINOZAKI YUTAKA |
发明人 |
MASATOKI TAMIHARU;SHINOZAKI YUTAKA |
分类号 |
G01N13/00;B23K1/00;B23K3/00;B23K31/12;G01N3/06;G01N3/40;H05K3/34;(IPC1-7):G01N33/00 |
主分类号 |
G01N13/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|