发明名称 Solderability testing apparatus and solderability testing method
摘要 This invention discloses a solderability testing apparatus which comprises a sample parts holding means having a sample parts holding member for holding a sample; an external force detection means for supporting such sample parts holding means; a solder paste container for containing a solder paste which is internally added with a flux; and a heating means for heating the solder paste; wherein such apparatus has a flux wetting preventive layer at least on the surface of a sample holding portion of the sample parts holding member.
申请公布号 US2002157486(A1) 申请公布日期 2002.10.31
申请号 US20020080132 申请日期 2002.02.21
申请人 MASATOKI TAMIHARU;SHINOZAKI YUTAKA 发明人 MASATOKI TAMIHARU;SHINOZAKI YUTAKA
分类号 G01N13/00;B23K1/00;B23K3/00;B23K31/12;G01N3/06;G01N3/40;H05K3/34;(IPC1-7):G01N33/00 主分类号 G01N13/00
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