发明名称 DEVICE AND METHOD FOR INSPECTING CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide an inspection device for circuit board that can efficiently and stably inspect the continuity condition of wiring patterns formed on a circuit board by using electrons generated by photoelectric effect. SOLUTION: While a wiring pattern 121 to be inspected is in a continuity condition, an electric field is generated between a pad section 121a of the wiring pattern 121 to be inspected and a plate electrode 51 by applying a voltage across a ball grid 121b of the wiring pattern 121 and the plate electrode 51 and an electron emitted from the pad section 121a of the wiring pattern 121 by the photoelectric effect by virtue of the emission of an electromagnetic wave is attracted to the plate electrode 51 side by the electric field. As a result, a conductive path starting from a power source 80 and returning to the power source 80 through the plate electrode 51 and the wiring pattern 121 is formed and it is possible to inspect the continuity of the wiring pattern 121 by measuring the current flowing in the wiring pattern 121.
申请公布号 JP2002318258(A) 申请公布日期 2002.10.31
申请号 JP20020007639 申请日期 2002.01.16
申请人 NIDEC-READ CORP 发明人 TSUJI YOSHIO;YAMADA MASAYOSHI
分类号 G01R1/06;G01R31/02;G01R31/28;G01R31/302;(IPC1-7):G01R31/02 主分类号 G01R1/06
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