发明名称 |
Apparatus and method for ball release |
摘要 |
There is disclosed a method and apparatus for ensuring release of objects such as solder balls from a pick head in a transfer and placement apparatus, comprising causing said pick head to vibrate by applying a vibration signal to said pick head over a range of frequencies. The range of frequencies is chosen such that it bounds the resonant frequencies of the pick head which may be calculated by computer simulation.
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申请公布号 |
US2002158108(A1) |
申请公布日期 |
2002.10.31 |
申请号 |
US20010843704 |
申请日期 |
2001.04.30 |
申请人 |
CHENG CHI WAH;CHOY JOSEPH PING KONG;CHONG BENSON PING CHUN;WONG KA KIN;CHAN CHI FUNG |
发明人 |
CHENG CHI WAH;CHOY JOSEPH PING KONG;CHONG BENSON PING CHUN;WONG KA KIN;CHAN CHI FUNG |
分类号 |
H01L21/60;B23K3/06;B23K35/02;H01L21/00;H01L21/683;H05K3/34;(IPC1-7):B23K1/06;B23K5/20;B23K35/12 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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