发明名称 |
Pattern formation method, mask for exposure used for pattern formation, and method of manufacturing the same |
摘要 |
In a pattern forming method, a cell pattern of each of memory cells is separated into a first pattern group provided at a predetermined position inside from an endmost portion of a cell and a second pattern group excluding the first pattern group. A mask size of the second pattern group is determined such that the second pattern group secures a sufficient process margin relative to a given size and size accuracy. A mask size of the first pattern group is optimized according to a peripheral pattern environment such that the first pattern group has a desired size under the above condition. A mask pattern of the memory cell is formed according to the mask size of the second pattern group and the first pattern group. The cell pattern is formed on a semiconductor wafer, using the mask pattern. |
申请公布号 |
US2002160279(A1) |
申请公布日期 |
2002.10.31 |
申请号 |
US20020132197 |
申请日期 |
2002.04.26 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
KOTANI TOSHIYA;TANAKA SATOSHI;INOUE SOICHI |
分类号 |
G03F1/08;G03F1/14;G03F1/36;G03F1/68;G03F7/20;H01L21/027;(IPC1-7):G03F9/00;G03C5/00 |
主分类号 |
G03F1/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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