发明名称 |
Semiconductor package and method of preparing same |
摘要 |
A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the surface of the wafer, provided at least a portion of each bond pad is not covered with the silicone layer and wherein the silicone layer is prepare by the method of the invention. |
申请公布号 |
US2002158317(A1) |
申请公布日期 |
2002.10.31 |
申请号 |
US20010789083 |
申请日期 |
2001.02.20 |
申请人 |
BECKER GREGORY SCOTT;GARDNER GEOFFREY BRUCE;HARKNESS BRIAN ROBERT;MALENFANT LOUISE ANN;SARMAH SATYENDRA KUMAR |
发明人 |
BECKER GREGORY SCOTT;GARDNER GEOFFREY BRUCE;HARKNESS BRIAN ROBERT;MALENFANT LOUISE ANN;SARMAH SATYENDRA KUMAR |
分类号 |
H01L23/12;G03F7/00;G03F7/075;G03F7/42;H01L23/14;H01L23/31;(IPC1-7):H01L23/02;H01L23/48 |
主分类号 |
H01L23/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|