发明名称 |
Leadframe-based chip scale package |
摘要 |
A leadframe-based CSP (50) comprises a leadframe (51) having a die attach pad (52) and a plurality of wire bonding pads (54), an aperture (65) disposed in the die attach pad (52), die (56) on the die attach pad, bonding wire(s) (58) electrically interconnecting the dies and the wire bonding pads, and a mold compound (60) which encapsulates the dies and the bonding wires to form the chip package (50) and which is formed in the aperture. <IMAGE> <IMAGE> |
申请公布号 |
EP1253640(A2) |
申请公布日期 |
2002.10.30 |
申请号 |
EP20020252687 |
申请日期 |
2002.04.16 |
申请人 |
TYCO ELECTRONICS CORPORATION |
发明人 |
PALMTEER, WILLIAM JAMES;BEUCLER, PHILIP JOSEPH |
分类号 |
H01L23/495;H01L23/66 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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