发明名称 METHOD AND APPARATUS FOR MEASURING ETCHING END POINT FOR CONDUCTIVE OXIDE LAYER LAMINATED ON FLAT DISPLAY DEVICE
摘要 PURPOSE: A method and an apparatus for measuring an etching end point for a conductive oxide layer laminated on a flat display device are provided to measure efficiently the etching end point for the conductive oxide layer of a glass substrate. CONSTITUTION: A PD-200 of an Asahi glass is prepared. A cleaning process and a rinsing process for the PD-200 are performed. A measuring electrode is formed after a dry process for the PD-200 is performed. The first dried sample is dried in a dry apparatus. Vacuum grease is applied on the second dried sample. The measuring sample is fabricated by performing the above processes. One side of the measuring sample is dipped into an etching solution. The other side of the measuring sample is connected with a resistance measuring device. A voltage between both electrodes is measured. Data are collected until a voltage of the measuring electrode approaches 0 volt. A time for an etching end point is calculated by using the collected data.
申请公布号 KR20020082042(A) 申请公布日期 2002.10.30
申请号 KR20010021795 申请日期 2001.04.23
申请人 IL DONG CHEMICAL CO., LTD. 发明人 KIM, MUN GU;NOH, JAE HO;YUM, DAE IL
分类号 H01L21/66;(IPC1-7):H01L21/66 主分类号 H01L21/66
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