发明名称 |
Laminate and method of manufacturing the same |
摘要 |
<p>A laminate (1) is made by adhering at least one metal layer (3) selected from the group consisting of copper and a copper alloy to a resin layer (2). A coating film (4) of an azole-copper complex compound formed by a contact with an aqueous solution containing an azole compound in an range from 0.1 mass % to 15 mass % and an organic acid in a range from 1 mass % to 80 mass % is formed on a surface of the metal layer (3), and the metal layer (3) adheres to the resin layer (2) via the coating film (4) of the azole-copper complex compound. Thereby, the present invention provides a laminate with improved adhesion between a surface of copper or a copper alloy and resin in a multilayered printed circuit board, and also a method of manufacturing the laminate. <IMAGE></p> |
申请公布号 |
EP1253813(A1) |
申请公布日期 |
2002.10.30 |
申请号 |
EP20020009464 |
申请日期 |
2002.04.25 |
申请人 |
MEC COMPANY LTD. |
发明人 |
KAWAGUCHI, MUTSUYUKI;HISADA, JUN;NAKAGAWA, TOSHIKO |
分类号 |
B32B15/08;B32B38/00;C23C22/52;H05K3/38;(IPC1-7):H05K3/38;C23F11/14 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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