Manufacturing electrode pads of a surface acoustic wave apparatus

摘要

The method for manufacturing a surface acoustic wave apparatus to be mounted via bumps by a flip chip bonding system prevents peeling of electrode pads from the piezoelectric substrate and cracks in the piezoelectric substrate from occurring during the formation of the bumps or at other times during the manufacturing process. In the method of manufacturing a surface acoustic wave apparatus, a first electrode layer 2a of the electrode pad is formed on a piezoelectric substrate 1 by etching, an electrode for a surface acoustic wave element 5a is formed by a lift-off method after the first electrode layer 2a is formed, and thereafter, an electrode film including a second electrode layer 7b of the electrode pad and a wiring electrode is formed.