发明名称 APPARATUS FOR PROCESSING SURFACE
摘要 PURPOSE: An apparatus for processing a surface is provided to process effectively a surface of a flat workpiece by minimizing variations of a shape and a position of a jig for sustaining the flat workpiece and separating easily the flat workpiece from the jig. CONSTITUTION: A plating processing device(50) has a plating processing bath(52) and a carrier unit(54). A couple of a plating solution supply pipes(58) is formed on an upper portion of a main body(56) of the plating processing bath(52). A plating solution is supplied to the main body(56) of the plating processing bath(52) through the plating solution supply pipe(58) and a branch pipe(64). A plurality of positive poles are arranged at the outside of the branch pipe(64) within the main body(56) of the plating processing bath(52). The carrier unit(54) includes a carrier guide(72), an upper sustain portion(74), and a carrier portion(76). The carrier unit is used for carrying a print circuit board(60) along a carrier path(62) within the plating processing bath(52). The carrier guide(72) has a couple of guide frames(78) and a plurality of wires(80). The upper sustain portion(74) has a couple of upper sustain clamps(75) in order to support an upper portion of the print circuit board(60). The carrier portion(76) is used for carrying the upper sustain portion(74) along the carrier path(62). The carrier portion(76) has a carrier rail(94) for supporting a slide member(92).
申请公布号 KR20020081907(A) 申请公布日期 2002.10.30
申请号 KR20010021401 申请日期 2001.04.20
申请人 ALMEX INC.;TKC CO., LTD. 发明人 ICHIKAWA KIYOSHI
分类号 H05K3/18;(IPC1-7):H05K3/18 主分类号 H05K3/18
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