METHOD FOR EXPOSING EDGE OF SEMICONDUCTOR WAFER

摘要

PURPOSE: An edge exposing method of a semiconductor wafer is provided to enhance productivity by using repetitious exposing processes. CONSTITUTION: A photoresist layer is formed on a wafer(100) having a flat zone with an edge region(200). The wafer(100) is then mounted on a wafer supporting part(300) in a WEE(Wafer Edge Exposure) equipment. A beam generating apparatus(400) including an optical source(410) and an exposure control mask(420) is then prepared. At least, two times of exposing processes are repetitiously performed by exposing the beam applied from the optical source(410) into the edge region(200) of the wafer(100) while the wafer rotates. The width of the edge region(200) is determined by the exposure control mask(420) located between the optical source(410) and the wafer supporting part(300).